Axcelis Announces Participation in SEMICON China 2026
Axcelis Announces Participation in SEMICON China 2026 |
| [18-March-2026] |
President and CEO Russell Low will Present Keynote Speech at CS Asia BEVERLY, Mass., March 19, 2026 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will be the Diamond Sponsor for the Compound Semiconductor Asia Conference (CS Asia) 2026, held in conjunction with SEMICON China 2026 on March 24-27, 2026, at the Kerry Hotel in Pudong, Shanghai.  Axcelis' President and CEO, Russell Low, PhD, will present an opening Keynote Speech at the event. Hongchen Zhao, PhD, Axcelis' Worldwide Applications Director, will present in Session 2: SiC, GaN and Related WBG Materials, Equipment and Devices-1. Advancing Power and Compound Semiconductor Performance Through Ion Implantation Innovation Innovative Implant Solutions Empower SiC Super Junction Cost Reduction President and CEO Russell Low, said, "We're excited to participate in SEMICON China and especially pleased to sponsor the CS Asia Conference, one of the most important technology forums in the Asia Pacific region. Global demand for clean, efficient energy solutions is rising, and power and compound semiconductor solutions are becoming increasingly critical. We are proud to be an innovation and market leader in ion implantation solutions in this market. We look forward to introducing our next generation Purion Power Series+ Platform to chipmakers in China." About Axcelis: CONTACTS: Axcelis Investor Relations Contact:
SOURCE Axcelis Technologies, Inc. | ||
Company Codes: NASDAQ-NMS:ACLS |
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