Lam Research and JSR Corporation/Inpria Corporation Enter Cross-Licensing, Collaboration Agreement to Advance Semiconductor Manufacturing
Lam Research and JSR Corporation/Inpria Corporation Enter Cross-Licensing, Collaboration Agreement to Advance Semiconductor Manufacturing |
[15-September-2025] |
Companies to Focus on Patterning forLeading-Edge Chips, Including Dry Resist EUV Lithography and Next-Generation Materials FREMONT, Calif. and TOKYO, Sept. 15, 2025 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX), a global leader in semiconductor fabrication equipment and services, and JSR Corporation, a leading technology company focused on materials innovation solutions and the parent company of Inpria Corporation, a metal oxide photoresist solution provider, today announced that Lam and JSR/Inpria have entered into a non-exclusive cross-licensing and collaboration agreement to advance leading-edge semiconductor manufacturing. The partnership is intended to accelerate the industry's transition to next-generation patterning, including dry resist technology for extreme ultraviolet (EUV) lithography, and advance the development of next-generation materials for atomic layer etching and deposition processes. Lam, JSR agreement intended to drive the industry's transition to next-gen patterning, including dry resist technology The agreement capitalizes on JSR group's innovative semiconductor materials, including metal oxide solutions, and Lam's deep capabilities in deposition, etch, and EUV patterning, including Aether®, Lam's groundbreaking dry resist equipment and process technology that reduces the cost and complexity of creating the intricate patterns required for chips for artificial intelligence (AI) and high-performance computing (HPC). The companies will collaborate to integrate JSR/Inpria's patterning resists and films with Lam's etch and dry resist deposition technologies. Lam and JSR/Inpria will also work together to expand innovation in several areas to support chipmakers as they scale in the AI era, including research and development related to metal oxide resists, high NA EUV patterning for advanced nodes, and other advanced films for next-generation patterning. In addition, leveraging JSR's recent acquisition of Yamanaka Hutech Corporation, Lam and JSR plan to explore new precursor materials and processes for advanced atomic layer deposition and etch solutions. "By richly complementing Lam's proven atomic layer deposition and etch capabilities with JSR's deep expertise in advanced patterning materials, this collaboration enables us to accelerate innovation at a time of rising semiconductor complexity," said Vahid Vahedi, chief technology and sustainability officer, Lam Research. "This includes driving new low-NA and high-NA EUV patterning materials and metal oxide resists and providing greater access to Aether dry resist technology." "At JSR, we are committed to advancing cutting-edge materials to enable our customers' most demanding technology roadmaps," said Toru Kimura, senior officer, JSR Corporation. "By combining JSR and Inpria's materials expertise with Lam Research's strengths in deposition, etch, and dry resist technologies, we aim to accelerate solutions for EUV lithography – including high NA – and support the industry to scale efficiently for the new AI era." Lam and Inpria have also agreed to dismiss all claims against each other in the litigation Inpria v. Lam Research (Case 1:22cv01359) in the District Court of Delaware and all related inter partes review (IPR) proceedings. About Lam Research About JSR Corporation Caution Regarding Forward-Looking Statements: *Editor's Note: This press release was distributed at 5 p.m. Pacific Time on September 15, 2025 / 9 a.m. Japan Standard Time on September 16, 2025 Lam Research Contacts: JSR Corporation Contacts:
SOURCE Lam Research Corporation; JSR Corporation | ||
Company Codes: NASDAQ-NMS:LRCX,NASDAQ:LRCX |
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