Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes
Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes |
[16-June-2025] |
Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced Technologies Highlights
SUNNYVALE, Calif., June 16, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with Samsung Foundry to power the next generation of designs for advanced edge AI, HPC, and AI applications. The collaboration between the companies is helping mutual customers achieve successful tape-outs of their complex designs using Synopsys' 3DIC Compiler and Samsung's advanced packaging technologies with fast turnaround time. Mutual customers can improve power, performance and area (PPA) with certified EDA flows for SF2P process, and minimize IP integration risk with the high-quality portfolio of IP on Samsung's most advanced process technologies. "The adoption of Edge AI applications is driving the need for advancements in semiconductor technologies to enable complex computational tasks, improve efficiency, and expand AI capabilities across various industries and applications," said John Koeter, senior vice president for the Synopsys IP Group. "Together with Samsung Foundry, we're enabling the most advanced AI processors across a broad spectrum of use cases from high-performance AI inference engines for data centers to ultra-efficient Edge AI devices like cameras and drones, all optimized for development on sub-2nm Samsung Foundry process technologies." "Synopsys and Samsung have deepened their collaboration to optimize PPA for designs using Samsung's advanced technologies," said Hyung-Ock Kim, vice president and head of the Foundry Design Technology Team at Samsung Electronics "With Synopsys' AI-driven design flows certified for Samsung's SF2 and SF2P processes, customers can seamlessly integrate these solutions into their workflows. This collaboration also provides access to Synopsys' broad portfolio of IP optimized for Samsung's advanced nodes. Additionally, our joint efforts in delivering multi-die solutions, including 2.5D automated routing with Synopsys' 3DIC Compiler and Samsung's I-CubeS™ technology, are pushing the boundaries of innovation in this domain." Successful Collaboration on Multi Die Design Collaboration on Design Technology Co-Optimization and EDA Flows In addition, Synopsys' AI-driven digital and analog flows have achieved certification on Samsung Foundry's SF2P process with hypercells enablement for more efficient use of standard cell space, improving overall PPA, along with certified digital and analog flows for SF2/SF2P generation nodes. The flows, powered by the Synopsys.ai™ full-stack EDA suite, allow mutual customers to accelerate development of differentiated SoCs on Samsung's advanced process technologies. Broad Portfolio of Synopsys IP for Samsung Foundry Speeds Time to Market About Synopsys © 2025 Synopsys, Inc. All rights reserved. Synopsys, the Synopsys logo, and other Synopsys trademarks are available at https://www.synopsys.com/company/legal/trademarks-brands.html. Other company or product names may be trademarks of their respective owners. Editorial Contact
SOURCE Synopsys, Inc. | ||
Company Codes: NASDAQ-NMS:SNPS |